When purchasing a BGA package, it's crucial to make sure you understand the different types of packages and the best way to fill them properly. If you're not aware of the correct way to fill them you'll be left with a package that doesn't function or a package that's too big or smaller than what you need for your project. In this article, we're going to explore the various types of package, including their advantages and disadvantages, and how to properly fill them. We'll also provide guidelines on choosing the appropriate package for your needs.
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Introduction. Underfill technique is used under the BGA to strengthen solder joints, and reinforce the product's resistance against vibration and thermal shock.
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